Putra, Devit Velanri (2028) PENGARUH ISOTHERMAL AGING TERHADAP SIFAT FISIK DAN MEKANIK PADUAN SOLDER BEBAS TIMBAL Sn-0.7Cu-1.5Ag-9Zn DAN Sn-0.7Cu-4Ag-7Zn Judul TA – Submit Jurnal. Bachelor thesis, Institut Teknologi Kalimantan.
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Abstract
Penggunaan solder bebas timbal berbasis Sn-Cu-Ag-Zn menjadi alternatif untuk menggantikan solder Sn-Pb yang berbahaya bagi lingkungan dan kesehatan. Penelitian ini bertujuan menganalisis pengaruh aging selama 24 jam pada temperatur 100°C, 125°C, 150°C, dan 175°C terhadap mikrostruktur, karakteristik termal, dan sifat mekanis paduan Sn-0,7Cu-1,5Ag-9Zn dan Sn-0,7Cu-4Ag-7Zn. Karakterisasi dilakukan menggunakan XRD, SEM-EDS, DSC, pengujian densitas, dan kekerasan Vickers. Hasil menunjukkan bahwa paduan Sn-0,7Cu-4Ag-7Zn terdiri atas fasa β-Sn, (Ag,Cu)Zn₄, AgZn, dan AgZn₃, sedangkan paduan Sn-0,7Cu-1,5Ag-9Zn terdiri atas β-Sn, (Ag,Cu)Zn₄, dan Cu₅Zn₈. Peningkatan temperatur aging menyebabkan pertumbuhan partikel intermetalik yang mengindikasikan terjadinya coarsening melalui mekanisme Ostwald ripening serta menurunkan nilai kekerasan pada kedua paduan. Hasil DSC menunjukkan bahwa paduan Sn-0,7Cu-4Ag-7Zn memiliki stabilitas termal yang lebih baik dibandingkan paduan Sn-0,7Cu-1,5Ag-9Zn. Secara keseluruhan, paduan Sn-0,7Cu-4Ag-7Zn menunjukkan kestabilan mikrostruktur, sifat termal, dan sifat mekanis yang lebih baik setelah perlakuan aging sehingga berpotensi digunakan sebagai solder bebas timbal untuk aplikasi temperatur tinggi.
| Item Type: | Thesis (Bachelor) |
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| Subjects: | A General Works > AS Academies and learned societies (General) |
| Divisions: | Jurusan Ilmu Kebumian dan Lingkungan > Teknik Material dan Metalurgi |
| Depositing User: | Devit Velanri Putra |
| Date Deposited: | 17 Jul 2026 07:56 |
| Last Modified: | 17 Jul 2026 07:56 |
| URI: | http://repository.itk.ac.id/id/eprint/26688 |
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