Analisis Pengaruh Variasi Komposisi Solder Sn-Ag-Cu-Zn Terhadap Keandalan Sambungan Pada Modul Sensor Suhu - Submit Jurnal

Rivaldi, Muhammad Fajar (2026) Analisis Pengaruh Variasi Komposisi Solder Sn-Ag-Cu-Zn Terhadap Keandalan Sambungan Pada Modul Sensor Suhu - Submit Jurnal. Bachelor thesis, Institut Teknologi Kalimantan.

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Abstract

Transisi industri elektronik menuju material bebas timbal menjadikan paduan Sn-Ag-Cu (SAC305) sebagai standar, namun material ini rentan terhadap degradasi keandalan akibat penuaan termal. Penelitian ini bertujuan menganalisis keandalan sambungan solder komposit Sn-Ag-Cu-Zn (SAC-Zn) dibandingkan SAC305 standar, difokuskan pada laju peningkatan resistansi dan stabilitas sinyal keluaran sensor suhu presisi LM35. Pengujian kuantitatif dilakukan melalui Isothermal Aging pada suhu 125°C selama 100 jam. Pemantauan dilakukan menggunakan instrumen in-situ otomatis berbasis ESP32-S3 dengan metode resistansi empat kawat (4-wire) dan Analog-to-Digital Converter (ADC) diferensial, yang terintegrasi telemetri Internet of Things (IoT). Hasil pengujian menunjukkan paduan SAC-Zn secara signifikan menekan laju degradasi kelistrikan. Sampel SAC305 mengalami peningkatan resistansi tertinggi (2,85%), sedangkan variasi 13Zn mencatatkan kenaikan terendah (0,54%). Pada stabilitas sinyal, 13Zn mendemonstrasikan kepresisian superior dengan Koefisien Variasi (CV) terendah sebesar 3,14%, membuktikan ketiadaan fluktuasi resistansi dinamis. Meskipun SAC305 mencatatkan Root Mean Square Error (RMSE) terendah akibat offset bias statis, ketangguhan SAC-Zn dalam mencegah fluktuasi hambatan parasitik menjadikannya material alternatif yang lebih andal untuk perangkat elektronik presisi tinggi.

Item Type:	Thesis (Bachelor)
Subjects:	Q Science > Q Science (General)
Divisions:	Jurusan Teknologi Industri dan Proses > Teknik Elektro
Depositing User:	Muhammad Fajar Rivaldi
Date Deposited:	20 Jul 2026 03:43
Last Modified:	20 Jul 2026 03:43
URI:	http://repository.itk.ac.id/id/eprint/27429

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